Silicone resin coating material
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In the late 1960s, with the development of China's electronic industry, it is necessary to use organosilicon encapsulating material with excellent electrical insulation performance, high temperature resistance, moisture resistance and non-combustion to encapsulate large and small power diodes, transistors, resistors, capacitors, integrated circuits and other electronic devices. In our country earlier engaged in the development of this kind of resin Zhang Xinghua, He Jigang, Chinese Academy of Sciences Institute of Chemistry and Shanghai resin factory Zhang Jikai, Li Yansheng, etc. They developed a variety of products to fill the domestic gap.
