Home    Company News    Current Situation and Trend of Silicone Resin in LED Packaging Technology -- Characteristics of Silicone Resin for LED Packaging

Current Situation and Trend of Silicone Resin in LED Packaging Technology -- Characteristics of Silicone Resin for LED Packaging

Hits: 510 img

Characteristics of organosilicon materials
Organosilicon polymer with Si -- O bond as the main chain, silicon atoms connected with organic groups, can have R3 SiO1/2 (M), R3 SiO2/2 (D), R3 SiO3/2 (T), R3 SiO2(Q) and other chains in accordance with a certain proportion of combination;
The Si -- O bond energy is higher, which makes it have better high temperature resistance or radiation performance, and the Si -- O bond Angle is larger, which makes the molecular chain of the material soft.
Silicone material has excellent properties in heat resistance, yellowing resistance and so on.
Silicone material is easy to be modified, and functional groups that can improve the refractive index, such as sulfur, benzene, phenol and epoxy group, can be introduced on the side chain to improve the refractive index of packaging materials and the luminous efficiency of LED

Online QQ Service, Click here

QQ Service

What's App