Silicone resin encapsulant
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In the late 1960s, with the development of China's electronics industry, silicone encapsulants with excellent electrical insulation properties, high temperature resistance, moisture resistance, and non-combustion are required to encapsulate high and low power diodes, transistors, and resistors , Capacitors, integrated circuits and other electronic devices. In China, Zhang Xinghua, He Jigang, etc. of the Institute of Chemistry, Chinese Academy of Sciences, and Zhang Jikai, Li Yansheng, etc. were engaged in the development of such resins earlier. A variety of products they developed filled the domestic gap.
