Flat copper wire coating types of main materials have these several:

Epoxy resin is a kind of high molecular polymer, the molecular formula is (C11H12O3)n, refers to the molecule contains more than two epoxy groups of a class of polymers. It is A polycondensation product of epichlorohydrin and bisphenol A or polyols. Because of the chemical activity of the epoxy group, it can be opened by a variety of compounds containing active hydrogen, curing and crosslinking to form a network structure, so it is a thermosetting resin. Epoxy resin temperature can be up to 150℃, with high hardness, wear resistance mechanical properties; The thermal expansion coefficient is close to PCB base material, so it is not easy to occur thermal stress failure caused by large gap in the process of use; The glass transition temperature is relatively high. It has good dielectric properties. However, there are some disadvantages in the application of epoxy resin, such as high risk of Cl ion content; Two-component ratio is difficult, viscosity is not easy to maintain; Potentially high internal stress; Difficulty in repairing; Low temperature performance is not good, curing shrinkage rate is high.

Silicone resin, also known as silicone resin, silicone resin has the advantages of wide working temperature range, good flexibility, good moisture and UV resistance, excellent dielectric properties, and substrate wettability, curing process is affected by moisture. Its shortcomings are also more obvious, low mechanical strength, scratch resistance, and substrate adhesion is not good. At present, sulfur corrosion occurs during the use of silicone.

For more information on epoxy silicone, please refer to the link.
https://www.siliconeresin.net/productcategory-epoxy-silicone-resin.html
Source: Network