By controlling the distribution of the filler in the matrix, a continuous thermal conductivity network is formed to enhance the thermal conductivity of the adhesive. The commonly used thermal conductivity fillers are metal materials (Fe, Mg, Al, Cu, Ag), carbon-based materials (carbon nanotubes, graphene, graphite), oxides (Al2O3, ZnO, BeO, SiO2), nitride (AlN, BN, Si3N4). Among them, metal materials and carbon-based materials are mostly non-insulating materials, while metal oxides and nitrides are mostly insulating materials. As a thermal conductive filler, it should have the following basic requirements: high thermal conductivity, no reaction with the polymer matrix, good chemical and thermal stability, etc. The thermal conductivity of the composite material formed by the thermal conductivity filler and polymer depends on the thermal conductivity of the filler itself, the filling situation of the filler in the matrix resin, and the interaction between the filler and the matrix. According to the different filling inorganic materials, filling thermal conductive adhesives are divided into thermal insulating adhesives and thermal non-insulating adhesives. Commonly used insulation filler Al2O3, AlN, SiO2, etc., non-insulating filler Ag, Cu, graphite, carbon nanotubes, etc. The silicon nitride and boron nitride insulating materials have become the focus of research due to their high thermal conductivity and low thermal expansion coefficient, but their high price limits their application in industrial production. For non-insulating filler, carbon based materials mainly include graphene, which has high thermal conductivity and good electrical conductivity, and is suitable for thermal conductivity non-insulating adhesive. Graphene can also be compounded with polymer with excellent electrical insulation performance to obtain thermal conductive insulation adhesive. At present, the main thermal conductive adhesives on the market are filled thermal conductive adhesives.