Methylphenyl silicone resin is the largest yield of silicone resin, the most widely used kind of products. The existing models of methylphenyl silicone resin at home and abroad generally have the disadvantages of low curing activity, weak adhesion of the cured film to the substrate, and easy re-adhesion of the cured film. These stubborn defects greatly limit the application of silicone resins.
The improved technology was used to save energy consumption and increase the yield of the product. In addition to retaining the excellent properties such as high and low temperature resistance, weathering resistance and high insulation strength, the methyl phenyl silicone resin obtained has completely overcome the serious shortcomings of the common methyl phenyl silicone resin, such as low curing activity, poor adhesion and easy re-adhesion after curing. The high curing active organosilicone resin synthesized by nucleophilic reaction can not only be cross-linked at lower temperature, but also the curing film of the silicone resin adheres firmly to a variety of substrates, and the cured film never sticks back, and the high curing active methylphenyl silicone resin has excellent bonding performance.