The chemical copolymerization method is to use reactive groups on the silicone polymer, such as hydroxyl, alkoxy, etc., to react with epoxy groups and other reactive groups on the epoxy resin to form a copolymer to achieve the purpose of modification. As early as 2007, some people abroad used this method to carry out research on the use of silicone copolymerization modified epoxy encapsulation materials for LED products. The experiments proved that this method can make the impact resistance and high and low temperature resistance of the encapsulation material obvious. Increase, shrinkage and thermal expansion coefficients are significantly reduced. Deborah et al. Used a condensation reaction to mix 4-vinylethylene oxide with various silanes such as bis (dimethylsilane) tetraphenylcyclotetrasiloxane and tris (dimethylsilane) phenylsiloxane. The reaction results in a modified epoxy resin product with excellent impact resistance, strong UV aging resistance, high light transmittance, and a thermal expansion coefficient that meets the requirements of chip products. Li Xueming and others used UV curing technology to hybridize polysilsesquioxane and epoxy resin in situ to obtain high light transmission, strong thermal stability, UV aging resistance, excellent impact resistance, and high adhesion. Epoxy polyorganosilicon sesquioxane hybrid film material can be used to replace the currently used high temperature curing epoxy materials for LED, electronic packaging and other industries.