The product is a solvent-free two-component room temperature curing high temperature epoxy adhesive with a solid content of >99.0%. It can be directly brushed, cured at room temperature or medium temperature, and has good heat resistance. It can be used for a long time at 155-180 °C, and the short-term use temperature can reach 200 °C.
Table 1 Two-component room temperature curing high temperature epoxy adhesive performance index
Test items
unit
Numerical value
solid
Chemical
before
Component


A
B
colour
/
Light yellow liquid
Reddish brown liquid
density
g/cm3
1.12~1.18
0.92~0.98
Viscosity
mPa·s
4,000 to 6,000
450～800
Solid content
%
>98.0
>98.0
mixing ratio
(mass ratio)
/
5
1
Initial viscosity
Pa·s
2,500 to 3,500
Curing time
Min
60 to 72 (25 ° C, 150 g)
Full cure time
h
24 (25 ° C, 150 g)
solid
Chemical
Rear
Dielectric loss
normal
<1.5
155 ° C
<6.0
Tensile shear strength
(steel substrate)
-40 ° C
>5.0
25°C
>6.0
135 ° C
>5.0
Tensile shear strength
(Insulating paper)
-40 ° C
>1.5
25°C
>1.7
135 ° C
>1.6
Breakdown voltage
kV/mm
>18.0
Heat resistance index
(secant method)
°C
>165
Maximum use temperature
°C
180
    Through the above product performance data, it can be found that the product has good heat resistance and low viscosity, and can be used for both metal substrates and insulating paper substrates at low temperature (-40 ° C), room temperature and high temperature (155 ° C). It has very good bonding properties and is very suitable for bonding or coating in special locations.