Polyurethane potting compound
Advantages: Excellent low temperature resistance, can use the catalyst to accelerate the curing without affecting its performance, so you can control the curing time of the gel.
Disadvantages: Poor heat resistance and easy foaming. After curing, the surface of the gel is not smooth and the toughness is poor. The anti-aging ability and anti-vibration ultraviolet rays are weak, and the colloid is easily discolored.
Scope of application: Suitable for potting and sealing indoor electrical components with low heat.
Epoxy resin potting compound
Advantages: Excellent high temperature resistance and electrical insulation, easy operation, stable before and after curing, excellent adhesion to a variety of metal substrates and porous substrates.
Disadvantages: The resistance to cold and heat changes is weak, and cracks are easily generated after being subjected to thermal shock, resulting in water vapor infiltrating into the electronic components from the cracks, and the moisture resistance is poor. And after curing, the colloid hardness is high and brittle, and it is easy to strain electronic components.
Scope of application: It is suitable for potting electronic components with normal temperature and no special requirements for environmental mechanical properties.
Silicone potting compound
Advantages: strong anti-aging ability, good weather resistance, excellent impact resistance; excellent resistance to cold and heat changes, can be used in a wide range of operating temperatures, can maintain elasticity in the temperature range of -60 ° C ~ 200 ° C, no Cracking; excellent electrical and insulating properties, effectively improve the insulation between internal components and lines after potting, improve the stability of the use of electronic components; no corrosive to electronic components and no reaction in the curing reaction Product; has excellent rework ability, can quickly and easily remove the repaired components after repair and replacement; has excellent thermal conductivity and flame retardant ability, effectively improve the heat dissipation capacity and safety factor of electronic components; low viscosity, good The fluidity can penetrate into small voids and components; it can be cured by curing at room temperature, self-discharge is good, and it is more convenient to use; the curing shrinkage is small, and it has excellent waterproof performance and shock resistance.
Disadvantages: high price and poor adhesion.
Scope of application: suitable for potting various electronic components working in harsh environments