Polyurethane electronic potting
   Polyurethane potting compound, also known as PU potting compound, usually consists of polyhydric alcohols such as polyacetate, polyether and polydiene, and diisocyanate, with a glycol or a diamine as a chain extender. to make.


Polyurethane potting
Suitable for potting of small and medium-sized electronic components, such as body regulators, motorcycle igniters, capacitors, neon electronic transformers, ballasts, lighting triggers, dry-type transformers, relays, etc.


use


8800W is a two-component polyurethane electronic potting compound with low stress, excellent impact resistance, stable electrical properties, good thermal conductivity and flame retardancy, and can be cured at room temperature or medium temperature.
Potting glue factory direct sales
Website: https://tieniujs.1688.com
Dongguan Tie Niu Electronic Materials Co., Ltd.








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Bead chain dynamic dividing line
The performance data is typical data tested at 70% humidity and 25°C temperature.


Potting glue precautions
Extend the heating time to remove moisture from the device; (A component will stratify after storage for a long time, please be sure to mix it evenly; the viscosity will become higher at low temperature, please preheat to 15 °C ~ 25 °C. Used)


Mixing: Weigh A and B materials proportionally. After weighing accurately, stir well. Stir the rod vertically while stirring, stir in the same direction for 2~3 minutes, try to reduce the stirring air. Pay attention to the bottom and edge of the container to be evenly mixed, otherwise there will be partial non-solidification; (the amount of one mixing should not be too much, can be controlled Within 200 grams, the excess will accelerate the reaction and shorten the operation time)


Defoaming: For those with high heat conduction requirements or smooth and non-bubble surface, the air bubbles can be removed by vacuuming (≤-0.1mpa), and the vacuuming time is generally controlled within 5 minutes; (using mechanical metering and mixing) Seal, omit steps 2, 3)


Pouring: The mixture is poured into the device. If the device structure is complex and the volume is large, it should be poured in several steps. (The bubbles generated in the pouring can be purged with a heat gun or the like to eliminate surface bubbling.)


Curing: room temperature 25 ° C, 12 hours can be cured, low temperature should be extended as appropriate. (This product is sensitive to moisture, it is recommended to control the operating environment at 23±3°C, relative humidity <70%)


*Maximum operating temperature is based on valid experimental results. The final operating temperature must be determined by the heat resistance rating of the device structure.