With the development of the electronics industry, people pay more attention to the stability of products and have more stringent requirements on the weather resistance of electronic products. Therefore, more and more electronic products need to be potted, and the electronic products after encapsulation can enhance them. Water resistance, shock resistance and heat dissipation protect electronic products from the natural environment and prolong their service life.
 
 
      Electronic potting compound is a kind of liquid glue that is poured on electronic components. It can provide excellent heat dissipation and flame retardant performance for electronic components. It can also effectively improve the seismic and moisture resistance of electronic components and ensure electronic components. Stability of use.
     So what is the performance requirement of an electronic potting compound suitable for electronic components?
1. Strong electrical insulation ability, which can effectively improve the insulation between internal components and lines after potting;
2, with hydrophobic performance, can improve the moisture resistance of electronic components after potting;
3, has excellent thermal conductivity, can effectively improve the heat dissipation capacity of electronic products after potting;
4, with excellent weather resistance and salt spray resistance, to ensure that electronic components are not affected by the natural environment;
5. The colloid does not have any corrosive effect on the electronic components;
6. The solidified colloid does not undergo deformation even after mechanical processing;
7, strong resistance to cold and heat, even if subjected to cold and heat changes between -60 ° C ~ 200 ° C, the colloid can still maintain elasticity, no cracking;
8, can be cured at room temperature can also be heated and cured;


 
       Potting of electronic products is generally selected from silicone potting, because it has good resistance to high and low temperature, can withstand cold and heat changes between -60 ° C ~ 200 ° C without cracking and maintain elasticity, using thermal materials After filling and modification, it has better thermal conductivity. After potting, it can effectively improve the heat dissipation capacity and moisture resistance of electronic components, and the silicone potting material is soft after curing, which is convenient for the maintenance of electronic equipment. Compared with the epoxy resin material, the electronic potting glue has high hardness after potting and curing. It is easy to strain electronic components, and has poor resistance to cold and heat. It is prone to small cracks during cold and hot deformation, affecting moisture resistance and temperature resistance. It is also only -10 ° C ~ 120 ° C, generally only suitable for electronic equipment that does not have special requirements for the environment.
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