Epoxy resin has a high refractive index and light transmittance, and the mechanical properties and bonding properties are quite good, so there are still certain products on the market. By introducing a silicone functional group-modified epoxy resin, the high-temperature use performance and impact resistance of the epoxy resin can be improved, the shrinkage rate and thermal expansion property of the product can be reduced, and the application range of the product can be improved. According to the reaction mechanism, silicone modified epoxy resin can be divided into physical blending and chemical copolymerization. If purely relying on pure physical blending, the solubility coefficient of silicone and epoxy resin is quite different, the microscopic phase structure is easy to be separated, and the modification effect is not good. Generally, it needs to be improved by adding a transition compatible group. Its compatibility. S. S. Hou et al. used a hydrosilylation reaction of a hydrogen-containing polysiloxane with allyl glycidyl ether to prepare an epoxy group-containing polysiloxane, which was then blended with a bisphenol A type epoxy resin. The experimental results show that the microstructure of the modified product is better and there is no phase separation.


The chemical copolymerization method utilizes reactive groups on the silicone polymer, such as a hydroxyl group, an alkoxy group, etc., to react with a reactive group such as an epoxy group on the epoxy resin to form a copolymer for modification. As early as 2007, some people in this country have used this method to develop epoxy resin encapsulation materials for LED products. The experiments show that the method can make the impact resistance and high and low temperature resistance of the package material obvious. The increase, shrinkage, and coefficient of thermal expansion are significantly reduced. Deborah et al. used a condensation reaction to mix 4-vinyl oxirane with various silanes such as bis(dimethylsilane)tetraphenylcyclotetrasiloxane and tris(dimethylsilane)phenylsiloxane. The reaction produces a modified epoxy resin product which is excellent in impact resistance, strong in UV aging resistance, high in light transmittance, and has a thermal expansion coefficient satisfying the requirements of the chip product. Li Xueming et al. used UV curing technology to cross-link hybridized polysilax sesquioxane and epoxy resin in situ to obtain high light transmission, thermal stability, UV aging resistance, excellent impact resistance and high adhesion. The epoxy polyorganosilsesquioxane hybrid membrane material can be used to replace the currently used high temperature curing epoxy materials for LED, electronic packaging and other industries. Seung Cheol Yang and other alicyclic epoxy resins react with diphenyldihydroxy and triphenylhydroxyl to produce a high refractive index (1.58), good thermal stability, and UV-resistant silicone epoxy modified materials. Huang Yunxin et al first synthesized oligomeric silsesquioxanes of different molecular weights and modified bisphenol A epoxy resins with synthetic polyorganosiloxanes. The results showed that all three polysiloxanes can improve epoxy resins. Product toughness and flexural strength. Yang Xin et al. prepared a polyfunctional silicone epoxy resin by hydrolysis-condensation reaction of 2-(3,4-epoxycyclohexyl)ethylmethyldiethoxysilane, using methyl hexahydrophthalic anhydride as curing agent. The obtained products have great improvement in light transmittance and heat aging resistance, and are expected to be popularized and applied in the field of LED packaging materials. Crivello. J, etc., using an epoxy monomer containing a double bond, an allyl glycidyl ether and a 4-vinyl epoxy cyclohexane, undergoing a hydrosilylation reaction with a hydrogen-containing polysiloxane to synthesize a silicone modification Epoxy resin with good transparency and heat resistance.


Silicone epoxy resin has recently been widely used due to its advantages in both epoxy resin and silicone resin. It exhibits mechanical properties, adhesion, aging resistance, UV resistance, and refractive index. Excellent performance is the research direction of LED packaging materials in the future, and significant progress will be made.