Epoxy resin is a macromolecule polymer with the molecular formula (CHO), which refers to the general name of a class of polymers containing more than two epoxy groups in the molecule. It is a combination of epichlorohydrin and bisphenol A or polyol. polycondensation product. Epoxy modified silicone resin product features: This product has excellent high and low temperature resistance, water and moisture resistance and good electrical insulation properties. After the product is fully cured, it has high hardness (≥2H), high gloss, good fullness and high temperature resistance.
IOTA 1063-55
Epoxy resin is generally used for the encapsulation of temperature measurement thermistors and the potting of temperature sensors, and the temperature used is preferably lower than 150 °C. Silicone is often used for thermistors and temperature sensors that use higher temperatures.
Technical index
Appearance: light yellow to yellow transparent liquid, allowing milky white light without mechanical impurities
Viscosity, cst (closed 4 cup): 50-100
Solid content,%: 55±1
Curing conditions: Surface dry at room temperature, fully cured with 250℃ for 20mins.
Heat resistance (varnish sheet) Tinplate sheet (200℃): ≥200h
Epoxy value: 0.02-0.07
Solvent: xylene/butanol
