[weiwenxin pcbworld] Super Gan company was founded in 1999, focusing on and rooted in PCB industry for 20 years. At present, it is transforming from a trading company to a technological innovation enterprise. Super Gan will continue to focus on how to use science and technology to transform and enhance productivity and competitiveness. One of the important projects is the resin plug technology.
Resin plug technology is a one-stop resin plug technology solution combining materials and equipment through cooperation with domestic nano material R & D enterprises and with independently developed vacuum plug equipment. At the same time, it also focuses on the application of heat conducting resin, especially in 5g terminal application.
01
Independent research and development of super Gan
The third generation of vacuum resin plug equipment
SG-VPH8003
This equipment adopts artificial engineering design, optimizes the operability and strengthens the stability of the equipment, occupies a small space, lightens the weight, and is more secure. It is also suitable for the processing requirements of oversized blind hole, back hole and plug hole with high thickness diameter ratio.
project
Sg-vph8003 vacuum plug machine
Maximum mesh size
1300 * 1300mm (maximum plate size 610x780mm)
Allowable print thickness
0.1mm~8mm
Maximum capacity
Standard cycle time 55-70 seconds / block. (1 printing)
Plug hole type
Through hole; blind hole; back hole
Hole diameter ratio of plug
Through hole: 1:40, blind hole: 1:5
Minimum plug hole diameter
Through hole: 0.15 mm blind hole: 0.1 mm
Appearance
Mirror stainless steel
Total machine weight
4500 kg
02
Plug resin, copper paste and thermal management material series cooperated by domestic nano material R & D Enterprises
Super Gan cooperates with R & D companies focusing on electronic functional materials in PCB industry to launch a series of plug resin, copper paste and thermal management materials on the basis of independent innovation of nano material technology, especially in the application of 5g client.
Super Gan and R & D company have done targeted research and development for the change of performance requirements of 5g board years ago. At present, they have successfully developed two high-end plug materials, 3f-sl and 5f-dr. their performance is particularly suitable for the plug hole requirements of 5g board, and they can open up some new applications.
The first is the ultra-low CTE characteristics. 3f-sl can adapt to almost all high-frequency and high-speed substrates on the market. There are many designs of back drilling and inner buried holes in 5g plate, which are very easy to produce cracks at the interface. 3f-sl and 5f-dr plug holes are used because of their high dimensional stability, and the thermal stress brought by matching with the substrate is smaller than that of conventional resin products, which can effectively control the occurrence of cracks.
Secondly, their dielectric constant is less than 3.0, and the loss of high frequency dielectric is very small, which is beneficial to the signal transmission of high frequency circuit. The thermal conductivity of 5f-dr is as high as 3W / m.k, which is conducive to the inner layer heat conduction out of the hole and improves the reliability of PCB.
It is difficult to grind the BGA dense hole of 5g plate, and the bad concave problem caused by grinding plate is also prominent. We solved this problem by innovatively using the characteristics of high dimensional stability of 3f-sl and 5f-dr.
Contact information
Address: 7-2, block B, building 2, Tongtai times center, Fuhai street, Bao'an District, Shenzhen, Guangdong Province
Tel: 0755-8947 7087
Fax: 0755-8947 7097
Website: www.superbold.com.hk
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——Printed circuit world
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