Silicone molded plastic is a thermosetting plastic that is mixed with silicone resin, fillers, catalysts, dyes, release agents and curing agents. Commonly used fillers include: glass fiber, asbestos, quartz powder, talc powder, mica, etc.; the catalyst is lead oxide, triethanolamine, and a mixture of triethanolamine and benzoyl peroxide; the commonly used release agent is calcium oleate.


There are two ways to process molding powder: one is compression molding; the other is transfer molding. The molding conditions are: temperature 175~200℃, pressure 300~700MPa, and molding curing time 15~30min. The molded parts are demolded by heat and delivered to the oven for curing at 90°C. The temperature is then slowly increased to 250°C, and finally a 72h post-curing is performed to improve the performance of the parts.


According to different uses, silicone molded plastics can be divided into two types: structural materials and semiconductor packaging. Silicone molded plastics used in structural materials are customarily called silicone plastics. They are characterized by high temperature resistance, moisture resistance, mechanical strength and electrical insulation properties that change little with temperature. Therefore, it is widely used in the rocket, aerospace, aircraft manufacturing, radio, electrical and instrument industries to make contactors, wiring boards, various heat-resistant insulating materials for high-power DC motors, and instruments that can be used for a long time above 200°C. Housings and components of electrical devices, such as brush frame rings, coil frames, electrical parts, incoming arc shields, printed circuit boards, resistors and reversing switches, distribution boards, etc. Silicone molded plastics used for packaging electronic components, semiconductor transistors, integrated circuits, etc. are flame-resistant, non-combustible, low water absorption, moisture-proof and non-corrosive, and remain stable over a wide range of temperatures, humidity and frequencies. Excellent electrical insulation and mechanical properties, thereby making the packaged semiconductor components immune to moisture, dust, impact, vibration, temperature and other factors.


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