LED encapsulation silica gel and its technical principle
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LED encapsulation with silica gel is generally high temperature curing liquid silica gel. Molded liquid silica gel has the following advantages:
(1) curing reaction conversion rate is high, no by-product generation, surface and internal curing uniform;
(2) the amount of catalyst is small;
(3) Product linear shrinkage rate is small, between 0% and 0.2%;
(4) good high and low temperature resistance, can be used at 150°C~200°C for a long time, at -60°C can still maintain elasticity;
(5) good electrical performance, at -60°C~200°C has good electrical insulation, and the dielectric constant and dielectric loss factor change little with frequency and temperature. According to the different refractive rate, LED encapsulated silica gel can be divided into methyl low folding silica gel and phenyl high folding silica gel.
